From Aluminum Dissolution in Supercapacitors to Electroplating: A New Way for Al Thin Film Deposition?

The present work addresses a new finding observed while performing aluminum dissolution experiments for supercapacitors (SCs) stability investigation. Supercapacitor (SC) electrodes based on carbon-coated foils are electrochemically cycled in harsh conditions into bis-trifluoromethylsulfonyl imide (TFSI)-based electrolyte and using Acetonitrile (ACN) as solvent. Dissolution of is with subsequent plating the carbonaceous surface counter electrodes. Moreover, same process can be reproduced also standard SC activated carbon This mechanism open way to an effective strategy achieve Al film deposition by electroplating becoming competitive most common copper counterpart.